Catch Defects Before They Cost You
Hidden solder bridges, tombstones, and voids can slip past manual checks—leading to field failures. Mirtec’s award-winning AOI and X-ray systems detect even the smallest flaws, ensuring every board meets your quality standards.-
Scale High-Mix Production Without Compromise
Switching between diverse product runs shouldn’t mean downtime. Mirtec’s modular inspection platforms adapt quickly to new PCBs and components, so you maintain throughput and on-time delivery. -
Shrink Cycle Times with Smart Automation
Lengthy inspections bottleneck your line and inflate costs. Mirtec combines fast-scanning optics, AI-driven defect classification, and integrated handling to deliver rapid, reliable inspection—keeping production moving. -
Ensure Compliance in Critical Industries
In medical, automotive, and aerospace markets, one defect can endanger lives. Mirtec’s precision inspection solutions meet the strictest industry standards, giving you confidence in every board you ship. -
Future-Ready Inspection for Next-Gen Electronics
As boards get denser and components shrink, old inspection methods fall short. Mirtec invests heavily in optics, lighting, and laser tech—so you can inspect tomorrow’s designs today.
Manufacturers struggle with ever-shrinking features, complex multi-layer boards, and the need to switch rapidly between product variants. Manual checks can’t keep pace, leading to undetected bridges, voiding, and misalignments that trigger costly rework, warranty claims, and recall risks.
Mirtec solves these challenges by marrying state-of-the-art optics, multi-camera 2D/3D AOI, and advanced X-ray inspection with flexible automation. Each platform is fine-tuned to your process—detecting surface defects down to microns, revealing hidden flaws beneath components, and seamlessly handing boards in and out of inspection. The result is higher first-pass yields, predictable throughput, and lower total cost of quality.
